Thermal stress related packaging failure in power IGBT modules

IEEE International Symposium on Power Semiconductor Devices & ICs (ISPSD)

Volumn , Issue , 1995, Pages 330-334

  Wu, Wu,chen ^a   Held, Marcel ^a   Jacob, Peter ^a   Scacco, Paolo ^a   Birolini, Alessandro ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

DIE BONDING; INSULATED GATE BIPOLAR TRANSISTORS (IGBT);

CRACK PROPAGATION; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); GATES (TRANSISTOR); INTEGRATED CIRCUIT TESTING; NUMERICAL METHODS; RELIABILITY; SEMICONDUCTOR DEVICE MODELS; SOLDERING; THERMAL EFFECTS; THERMAL STRESS;

BIPOLAR TRANSISTORS;

EID: 0029178676     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)