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Volumn , Issue , 1994, Pages 97-100
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Progression of multilevel metallization beyond 0.35 micron technology
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESION;
ALUMINUM ALLOYS;
ANTIREFLECTION COATINGS;
CHEMICAL POLISHING;
CHEMICAL VAPOR DEPOSITION;
COPPER;
LITHOGRAPHY;
MASKS;
PERMITTIVITY;
POLYMERS;
CHEMICAL MECHANICAL PLANARIZATION (CMP);
CHEMICAL MECHANICAL POLISHING (CMP);
COMPLEX INTEGRATION;
PHASE SHIFT MASKS (PSM);
METALLIZING;
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EID: 0028755466
PISSN: 01631918
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (1)
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References (13)
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