Thin film effects in ultrasonic wafer thermometry

Proceedings of the IEEE Ultrasonics Symposium

Volumn 3, Issue , 1994, Pages 1337-1341

  Degertekin, F L ^a   Pei, J ^a   Honein, B V ^a   Khuri Yakub, B T ^a   Saraswat, K C ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ANISOTROPY; DENSITY (SPECIFIC GRAVITY); ELECTROMAGNETIC DISPERSION; ELECTROMAGNETIC WAVE TRANSMISSION; MATHEMATICAL MODELS; MULTILAYERS; SILICA; SILICON WAFERS; TEMPERATURE MEASUREMENT; THIN FILMS;

LAMB WAVES; SURFACE IMPEDANCE APPROACH; TIME OF FLIGHT SENSITIVITY; ULTRASONIC WAFER THERMOMETRY;

ULTRASONIC MEASUREMENT;

EID: 0028750616     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ultsym.1994.401839     Document Type: Conference Paper

References (9)