3-D packaging - applications of vertical multichip modules (MCM-V) for microsystems

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn 1, Issue , 1994, Pages 387-

  Val, Christian ^a  

^a THALES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; ELECTRONIC EQUIPMENT; INTERCONNECTION NETWORKS; MULTICHIP MODULES; PIEZOELECTRIC DEVICES; THREE DIMENSIONAL; VIDEO CAMERAS;

HETEROGENEOUS DEVICES; MICROSYSTEMS; TWO DIMENSIONAL;

ELECTRONICS PACKAGING;

EID: 0028744345     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)