Device characteristic changes caused by packaging stress

American Society of Mechanical Engineers, Applied Mechanics Division, AMD

Volumn 195, Issue , 1994, Pages 101-109

  Miura, Hideo ^a   Nishimura, Asao ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFIERS (ELECTRONIC); COMPUTATIONAL METHODS; CONDUCTIVE MATERIALS; ELECTRIC CURRENTS; ELECTRONICS PACKAGING; LSI CIRCUITS; RESIDUAL STRESSES; SEMICONDUCTOR DEVICE MANUFACTURE; SENSITIVITY ANALYSIS; STRESS ANALYSIS; STRESS CONCENTRATION;

CURRENT FLOW; PACKAGING STRESS EFFECT; STRESS SENSITIVITY;

MOSFET DEVICES;

EID: 0028735472     PISSN: 01608835     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (22)