High-Density Laser Linking Of Metal Interconnect

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 17, Issue 4, 1994, Pages 590-593

  Radomski, Aaron T ^b   Ventura, Thomas M ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^b Department of Defense Fort George G Meade ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; FRACTURE; LASER BEAM EFFECTS; LOGIC GATES; MICROSTRUCTURE; REDUNDANCY; THERMAL EXPANSION;

HIGH DENSITY LASER LINKING; METAL INTERCONNECTS; RESTRUCTURABLE INTEGRATED CIRCUITS;

ELECTRIC WIRING;

EID: 0028733512     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.335046     Document Type: Article

References (8)

1. G.H. Chapman, J.M. Canter, and S.S. Cohen, “The technology of laser formed interactions for wafer-scale integration,” in Proc. Int. Conf. Wafer Scale Integration, ÍEEE Computer Society Press, 1989, pp. 21–29.
2. J.B. Bernstein, E.F. Gleason, and P.W. Wyatt, “High density metal cross-point laser linking,” in Proc. Int. Conf. Wafer Scale Integration, IEEE Computer Society Press, 1992, pp. 176–181.
3. H.D. Hartmann and Th. Hillmann-Ruge, “Yield and reliability of laser formed vertical links,” in Proc. Multilevel Interconnections: Issues that Impact Competitiveness, SPIE vol. 2090, 1993, pp. 146–160.
4. M. Rouillon-Martin, M. Chambon, and A. Boudou, “Laser programmable vias for reconfiguration of integrated circuits,” in Proc. Optical Microlithügraphy and Metrology for Microcircuit Fabrication, SPIE vol. 1138, 1989, pp. 190–197.
5. D. Bursky, “Laser programming turns 18-Kgate arrays around fast,” Electron. Design, vol. 40, pp. 30–31, May 28, 1992.
6. J. Raffel, A.H. Anderson, and G.H. Chapman, “Laser restructurable technology and design,” in Wafer Scale Integration. Norwell, MA: Kluwer Academic, 1989, ch. 7, pp. 319–363.
7. S.S. Cohen, P.W. Wyatt, G.H. Chapman, and J.M. Canter, “Laser-induced diode linking for wafer-scale integration,” IEEE Trans. Electron. Devices, vol. 35, pp. 1533–1550, Sept. 1988.
8. R.A. Lee et al., “Laser programmable interconnects for the quick turn around for electronic systems,” in Proc. Government Microcircuit Applications Conference (GOMAC), 1993, pp. 81–83.