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Volumn 253, Issue 1-2, 1994, Pages 440-444
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Comparison of chemical vapor deposition of TiN using tetrakis-diethylamino-titanium and tetrakis-dimethylamino-titanium
a a |
Author keywords
Metallization; Organometallic vapour deposition; Titanium nitride
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Indexed keywords
AMMONIA;
AUGER ELECTRON SPECTROSCOPY;
CHARACTERIZATION;
CHEMICAL VAPOR DEPOSITION;
ELECTRIC CONDUCTIVITY;
FILM GROWTH;
MORPHOLOGY;
PRESSURE EFFECTS;
SURFACES;
THERMAL EFFECTS;
TITANIUM NITRIDE;
TUNGSTEN;
GROWTH RATE;
STEP COVERAGE;
TETRAKIS DIETHYLAMINO TITANIUM;
TETRAKIS DIMETHYLAMINO TITANIUM;
TITANIUM NITRIDE FILMS;
NITRIDES;
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EID: 0028733315
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/0040-6090(94)90363-8 Document Type: Article |
Times cited : (56)
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References (22)
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