-
1
-
-
84939723667
-
An SEU Resistant 256K SOI SRAM
-
L.R. Hite, H. Lu, T.W. Houston, D.S. Hurta, and W.E. Bailey, “An SEU Resistant 256K SOI SRAM”, IEEE Trans. Nuclear Science, Vol. 39, No. 6, p. 2121 (1992).
-
(1992)
IEEE Trans. Nuclear Science
, vol.39
, Issue.6
, pp. 2121
-
-
Hite, L.R.1
Lu, H.2
Houston, T.W.3
Hurta, D.S.4
Bailey, W.E.5
-
2
-
-
0026385069
-
Body Tie Placement in CMOS/SOI Digital Circuits for Transient Radiation Environments
-
M.L. Alles, S.E. Kerns, L.W. Massengill, J.E. Clark, K.L. Jones, and R.E. Lowther, “Body Tie Placement in CMOS/SOI Digital Circuits for Transient Radiation Environments”, IEEE Trans. Nuclear Science, Vol. 38, No. 6, p. 1259 (1991).
-
(1991)
IEEE Trans. Nuclear Science
, vol.38
, Issue.6
, pp. 1259
-
-
Alles, M.L.1
Kerns, S.E.2
Massengill, L.W.3
Clark, J.E.4
Jones, K.L.5
Lowther, R.E.6
-
3
-
-
0026711773
-
-
A. Edenfeld, L.K. Wang, J. Seliskar, and N.F. Haddad, 1991 IEEE International SOI Conference Proceedings, p. 130.
-
(1991)
IEEE International SOI Conference Proceedings
, pp. 130
-
-
Edenfeld, A.1
Wang, L.K.2
Seliskar, J.3
Haddad, N.F.4
-
4
-
-
84939706628
-
-
L.K. Wang, J. Seliskar, A. Edenfeld, O. Spencer, and N.F Haddad, Proceedings of the Fifth International Symposium on Silicon-On-Insulator Technology and Devices, p. 71 (1991).
-
(1991)
Proceedings of the Fifth International Symposium on Silicon-On-Insulator Technology and Devices
, pp. 71
-
-
Wang, L.K.1
Seliskar, J.2
Edenfeld, A.3
Spencer, O.4
Haddad, N.F.5
-
5
-
-
84939718175
-
Radiation Hardened ULSI Technology and Design of IMSRAM
-
presented at the NSREC
-
N.F. Haddad, J.D. Mairnon, S. Doyle, L. Jacunski, T. Hoang, D. Lawson, D. Jallice, and T. Scott, “Radiation Hardened ULSI Technology and Design of IMSRAM”, presented at the 1994 NSREC.
-
(1994)
-
-
Haddad, N.F.1
Mairnon, J.D.2
Doyle, S.3
Jacunski, L.4
Hoang, T.5
Lawson, D.6
Jallice, D.7
Scott, T.8
-
6
-
-
84939757534
-
Temperature Sensitivity of Devices and Circuits Fabricated in Fully-Depleted Accumulation Mode SOI
-
F. T. Brady, N.F. Haddad, J.A. Miller, J. Seliskar, and L.K. Wang, “Temperature Sensitivity of Devices and Circuits Fabricated in Fully-Depleted Accumulation Mode SOI”, 1992 IEEE International SOI Conference Proceedings, p. 90.
-
(1992)
IEEE International SOI Conference Proceedings
, pp. 90
-
-
Brady, F.T.1
Haddad, N.F.2
Miller, J.A.3
Seliskar, J.4
Wang, L.K.5
-
8
-
-
84939746952
-
Recombination Centers in a Radiation-Hardened Field Insulator
-
C.E. Schlier, N.F. Haddad, H.S. Witham, and P.M. Lenahan, “Recombination Centers in a Radiation-Hardened Field Insulator”, Journal of Radiation Effects Research and Engineering, Vol. 7, No. 7, (1989).
-
(1989)
Journal of Radiation Effects Research and Engineering
, vol.7
, Issue.7
-
-
Schlier, C.E.1
Haddad, N.F.2
Witham, H.S.3
Lenahan, P.M.4
-
9
-
-
0042077985
-
Total Dose Hardness of Bonded SOI Wafers
-
J.B. McKitterick, A. Caviglia, and W.P. Maszara, “Total Dose Hardness of Bonded SOI Wafers”, IEEE Transactions on Nuclear Science, Vol. 36, p. 2098 (1992).
-
(1992)
IEEE Transactions on Nuclear Science
, vol.36
, pp. 2098
-
-
McKitterick, J.B.1
Caviglia, A.2
Maszara, W.P.3
|