Consumables for the chemical mechanical polishing (CMP) of dielectrics and conductors

Materials Research Society Symposium - Proceedings

Volumn 337, Issue , 1994, Pages 121-131

  Jairath, Rahul ^a   Desai, Mukesh ^a   Stell, Matt ^a   Tolles, Robert ^a  

^a SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; ALUMINA; CERIUM COMPOUNDS; CHEMISTRY; CLEANING; DIELECTRIC FILMS; METALLIC FILMS; SILICA; SLURRIES; SURFACE PROPERTIES; VLSI CIRCUITS;

CERIA; CHEMICAL MECHANICAL POLISHING; PLANARIZATION; POLISHING PAD;

CHEMICAL POLISHING;

EID: 0028594866     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-337-121     Document Type: Conference Paper

References (10)