Novel electrolysis-ionized-water cleaning technique for the chemical-mechanical polishing (CMP) process

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 1994, Pages 79-80

  Aoki, Hidemitsu ^a   Nakajima, Tsutomu ^a   Kikuta, Kuniko ^a   Hayashi, Yoshihiro ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; ELECTRIC RESISTANCE; ELECTROLYSIS; ETCHING; PARTICLES (PARTICULATE MATTER); PH; POLISHING; SCANNING ELECTRON MICROSCOPY; SILICA;

CHEMICAL MECHANICAL POLISHING; RINSING EFFECT; SPIN RINSER;

CLEANING;

EID: 0028561329     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)