Scattering Parameter-Based Simulation of Transients in Lossy Nonlinearly Terminated Packaging Interconnections

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 17, Issue 4, 1994, Pages 472-479

  Vakanas, Loizos P ^a   Cangellaris, Andreas C ^a   Palusinski, Olgierd A ^a  

^a UNIVERSITY OF ARIZONA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BIPOLAR TRANSISTORS; CMOS INTEGRATED CIRCUITS; ELECTRIC LOSSES; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; FAST FOURIER TRANSFORMS; MATHEMATICAL MODELS; MICROELECTRONICS; MULTICHIP MODULES; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICES; TRANSIENTS;

DRIVER CIRCUITS; MICROELECTRONIC PACKAGING; NONUNIFORMITIES; RECEIVER CIRCUITS; SINGLE CHIP CARRIERS; TRANSIENT ANALYSIS;

ELECTRIC LINES;

EID: 0028539767     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.338711     Document Type: Article

References (21)

1. H. A. Wheeler, “Formulas for the skin depth,” Proc. IRE, vol. 30, pp. 412-424, Sept. 1942.
2. A. C. Cangellaris, “The importance of skin-effect in microstrip lines at high frequencies,” in Proc. 1988 IEEE MTT-S Internat. Microwave Sympos., New York, May 1988, pp. 197-198.
3. L. P. Vakanas, A. C. Cangellaris, and J. L. Prince, “Frequency-dependent [L] and [R] matrices for lossy microstrip lines,” Trans. Society Computer Simulation, vol. 8, no. 4, pp. 281-318, Dec. 1991.
4. A. J. Gruodis and C. S. Chang, “Coupled lossy transmission line characterization and simulation,” IBM J. Res. Develop., vol. 25, no. 1, pp. 25-41, Jan. 1981.
5. F. Y. Chang, “The generalized method of characteristics for waveform relaxation analysis of lossy coupled transmission lines,” IEEE Trans. Microwave Theory Technol., vol. MTT-37, no. 12, pp. 2028-2038, Dec. 1989.
6. V. K. Tripathi and J. B. Rettig, “A SPICE model for multiple coupled microstrips and other transmission lines,” IEEE Trans. Microwave Theory Technol., vol. MTT-33, pp. 1513-1518, Dec. 1985.
7. O. A. Palusinski, D. J. Lee, and L. P. Vakanas, “Comments on simulation of lossless symmetrical three conductor systems,” IEEE Trans. Computer-Aided Design, vol. 12, no. 10, pp. 1617-1619, Oct. 1993.
8. A. R. Djordjevic and T. K. Sarkar, “Analysis of time response of lossy multiconductor transmission line networks,” IEEE Trans. Microwave Theory Technol., vol. MTT-35, pp. 898-908, Oct. 1987.
9. J. R. Griffith and M. S. Nakhla, “Time-domain analysis of lossy coupled transmission lines,” IEEE Trans. Microwave Theory Technol., vol. MTT-38, no. 10, pp. 1480-1487, Oct. 1990.
10. O. A. Palusinski and A. Lee, “Analysis of transients in nonuniform and uniform multiconductor transmission lines,” IEEE Trans. Microwave Theory Technol., vol. MTT-37, no. 1, pp. 127-138, Ian. 1989.
11. N. Orthanovic, P. Wang, and V. K. Tripathi, ‘Time-domain simulation of uniform and nonuniform multiconductor lossy lines by the method of characteristics,” IEEE Trans. CAD Des. Integ. Circ. Syst., vol. 12, no. 6, pp. 900-904, June 1993.
12. K. S. Oh and J. E. Schutt-Aine, ‘Transient analysis of coupled, tapered transmission times with arbitrary nonlinear terminations,” IEEE Trans. Microwave Theory Technol., vol. MTT-41, no. 2, pp. 268-273, Feb. 1993.
13. J. E. Schutt-Aine and R. Mittra, “Nonlinear transient analysis of coupled transmission lines,” IEEE Trans. Circ. Syst., vol. 36, no. 7, pp. 959-967, July 1989.
14. T. Dhaene and D. De Zutter, “Extended scattering matrix approach for transient analysis of coupled dispersive lossy transmission lines with arbitrary loads,” Electromagnetics, vol. 13, pp. 51-66, 1993.
15. N. Fache and D. De Zutter, “Circuit parameters for single and coupled microstrip lines by a rigorous full-wave space domain analysis,” IEEE Trans. Microwave Theory Technol., vol. MTT-37, no. 2, pp. 421-425, Feb. 1989.
16. D. Winklestein, M. B. Steer, and R. Pomerleau, “Simulation of arbitrary transmission line networks with nonlinear terminations,” IEEE Trans. Circ. Syst., vol. 38, no. 4, pp. 418-422, Apr. 1991.
17. W. Beyene, “bilevel waveform relaxation analysis of package interconnects using scattering parameters,” in Proc. ISHM, Internat. Symp. Microelectronics, 1992, pp. 156-161.
18. P. A. Rizzi, Microwave Engineering. Englewood Cliffs, NJ: Prentice-Hall, 1988.
19. L. P. Vakanas, “A scattering parameter-based method for the transient analysis of lossy, coupled, nonlinearly terminated transmission line structures in high-speed microelectronic circuits,” Ph.D. dissertation, Dept. Electr. Comp. Eng., Univ. Arizona, Tucson, AZ, Dec. 1993.
20. J. E. Morris, Electronics Packaging Forum, Vol. I. Tucson, AZ: Van Nostrand, 1990, pp. 97-99.
21. C. E. Baumgartner, “Simulation methods for multiconductor transmission lines in electronic applications,” Ph.D. dissertation, Univ. Arzona, Tucson, AZ, Feb. 1992.