Decision modeling for thermal stress screening of commercial electronics

Microelectronics Reliability

Volumn 34, Issue 10, 1994, Pages 1643-1656

  Landers, Thomas L ^a   Martin, Kevin ^b   English, John R ^a  

^a UNIVERSITY OF ARKANSAS   (United States)

^b UNIVERSITY OF OKLAHOMA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DECISION THEORY; DEFECTS; ENVIRONMENTAL IMPACT; MATHEMATICAL MODELS; QUALITY ASSURANCE; QUALITY CONTROL; RELIABILITY; SERVICE LIFE; THERMAL STRESS;

ENVIRONMENTAL STRESS SCREENING; LATENT DEFECTS; THERMAL STRESS SCREENING;

MICROELECTRONICS;

EID: 0028518579     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/0026-2714(94)90049-3     Document Type: Article

References (7)

1. The Necessity of ‘Testing-in’ Hardware Reliability
2. Optimized Environmental Stress Screening of U.S. Army Electronic Hardware
3. Commercial Integration of Thermal Stress Screening