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Volumn 212-215, Issue PART 1, 1994, Pages 835-839

Thermal conductivity of reaction bonded and reaction sintered silicon/silicon carbide composites

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CERAMIC MATERIALS; GRAIN SIZE AND SHAPE; LASER APPLICATIONS; SILICON; SILICON CARBIDE; SINTERING; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL VARIABLES MEASUREMENT;

EID: 0028498542     PISSN: 00223115     EISSN: None     Source Type: Journal    
DOI: 10.1016/0022-3115(94)90172-4     Document Type: Article
Times cited : (7)

References (20)
  • 12
    • 84913069383 scopus 로고    scopus 로고
    • E. Scafé, G. Giunta, L. Fabbri, L. Di Rese, G. De Portu and S. Guicciardi, to be submitted to J. Europ. Ceram. Soc.
  • 15
    • 0003146447 scopus 로고
    • Role of Structure and Composition in the Heat Conduction Behavior of Silicon Carbide
    • (1989) Therm. Cond. , vol.20 , pp. 141
    • Hasselman1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.