Neutral Particle Flux Calculations in Plasma Etching for Cylindrical Trench Holes

Journal of the Electrochemical Society

Volumn 141, Issue 9, 1994, Pages 2453-2459

  Hubner H ^a   Engelhardt, M ^a  

^a SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; CAPACITORS; GAS DYNAMICS; IONS; PLASMAS; RANDOM ACCESS STORAGE; VACUUM TECHNOLOGY;

ASPECT RATIO; CYLINDRICAL TRENCH HOLES; NEUTRAL PARTICLE FLUX; REACTIVE ION ETCHING;

ETCHING;

EID: 0028498461     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/1.2055141     Document Type: Article

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