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Volumn 346, Issue 3, 1994, Pages 476-495

The OPAL silicon strip microvertex detector with two coordinate readout

(36)  Allport, P P a   Batley, J R a   Beck, G A e   Carter, A A e   Carter, J R a   de Jong, S J e   do Couto e Silva, E d   Duboscq, J E b   Dunwoody, U C a   Gibson, V a   Glessing, W b   Goldey, P R f   Goodrick, M J a   Hammarstrom R b   Hanson, G G d   Honma, A K i   Humbert, R c   Jacob, F h   Jimenez, M b   Koetke, D S b   more..


Author keywords

[No Author keywords available]

Indexed keywords

CALORIMETERS; COLLIDING BEAM ACCELERATORS; IONIZATION CHAMBERS; MAGNETIC FIELDS; MICROPROCESSOR CHIPS; NUCLEAR ENERGY; PARTICLE BEAM TRACKING; PERFORMANCE; PRINTED CIRCUITS; RADIOACTIVITY MEASUREMENT; READOUT SYSTEMS;

EID: 0028484945     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/0168-9002(94)90583-5     Document Type: Article
Times cited : (187)

References (41)
  • 10
    • 84913072593 scopus 로고    scopus 로고
    • Detectors manufactured by Micron Semiconductors Ltd., Lancing, Sussex, UK.
  • 12
    • 84913061608 scopus 로고    scopus 로고
    • z-print processing by OPTIMASK, Paris, France.
  • 13
    • 84913037500 scopus 로고    scopus 로고
    • Q1-9226 thermoconductive silicone adhesive by Dow Corning, Seneffe, Belgium.
  • 14
    • 84913030209 scopus 로고    scopus 로고
    • Pitch adaptor processing by CSEM, Neuchatel, Switzerland.
  • 15
    • 84913075783 scopus 로고    scopus 로고
    • Bonding was performed on a Hughes model 2470 II automatic bonding machine, Hughes Aircraft Company, Carlsbad, CA, USA.
  • 16
    • 84913079096 scopus 로고    scopus 로고
    • The solder alloy was Woods Metal (Bi/Pb/Cd/Sn). This was used to join the dissimilar metals of the aluminium alloy ring to the stainless steel cooling manifold. The joint was made before final machining and at low temperature to avoid differential thermal expansion problems. Woods Metal by Goodfellow, Cambridge, UK.
  • 17
    • 0024611860 scopus 로고
    • The MX7 chip was designed at the Rutherford Appleton Laboratory, UK. The chip was manufactured by MIETEC N.V., Oudenaarde, Belgium. The reference for microplex (MX) series chips is:
    • (1989) IEEE Trans. Nucl. Sci. , vol.36 , pp. 522
    • Stanton1
  • 19
    • 84913019771 scopus 로고    scopus 로고
    • Beryllium oxide ceramic: BeO 97.9%, milled to dimensions 33 mm×55 mm, Beramic Z substrate by CBL Ceramics Ltd., Milford Haven, DYFED, UK.
  • 20
    • 84913016838 scopus 로고    scopus 로고
    • Printed circuit by Ascom Favag AG, Bevaix, Switzerland.
  • 21
    • 84913023665 scopus 로고    scopus 로고
    • ACT 1010A Field Programmable Gate Arrays by Actel Corp., Sunnyvale, CA, USA.
  • 24
    • 84913022849 scopus 로고    scopus 로고
    • Digital signal processors used were Motorola DSP 56001, by Motorola Inc., Phoenix, AR, USA.
  • 25
    • 84913054237 scopus 로고    scopus 로고
    • Fastbus-to-VSB interface module FVSBI 9210 from CES, Petit-Lancy, Switzerland.
  • 27
    • 84913079402 scopus 로고    scopus 로고
    • VME processor modules used were Motorola MVME167 with MC68040 processor, by Motorola Inc., Phoenix, AR, USA.
  • 28
    • 84913037993 scopus 로고    scopus 로고
    • Fastbus communications processor used was a CES FIC8230 with MC68020 processor, by CES, Petit-Lancy, Switzerland.
  • 33
    • 84913077360 scopus 로고    scopus 로고
    • VESTALE V15R, 1500 W and 1000 W battery backed up power supplies from Serras, Rungis, France.
  • 35
    • 84913065531 scopus 로고    scopus 로고
    • P.C. Burkimsher, The EMU User Guide, CERN/CN Division.
  • 38
    • 84913046685 scopus 로고    scopus 로고
    • LABEN S.p.A., Milano, Italy.
  • 39
    • 84913020281 scopus 로고    scopus 로고
    • Melcor CP 1.4-127-06 L heat pump elements from Melcor, Trenton, NJ, USA.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.