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Journal of the American Ceramic Society

Volumn 77, Issue 7, 1994, Pages 1846-1850

Effect of Yttria on the Thermal Conductivity of Aluminum Nitride

(3) de Baranda, Pedro Sainz a Knudsen, Arne K b Ruh, Edwin c

a Union Technologica Espana ^* (Spain)

b DOW CHEMICAL COMPANY (United States)

c RUTGERS UNIVERSITY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; BINDERS; CALCIUM COMPOUNDS; COMPOSITION EFFECTS; HEAT CONDUCTION; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SILICA; THERMAL CONDUCTIVITY; THERMAL VARIABLES MEASUREMENT; X RAY ANALYSIS; YTTRIUM COMPOUNDS;

ALUMINUM NITRIDE; VOLUME FRACTION; X RAY DIFFRACTION; YTTRIA;

NITRIDES;

EID: 0028478937 PISSN: 00027820 EISSN: 15512916 Source Type: Journal
DOI: 10.1111/j.1151-2916.1994.tb07060.x Document Type: Article

Times cited : (56)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.