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Volumn 77, Issue 5, 1994, Pages 1217-1227
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Creep and Stress Rupture Behavior of an Advanced Silicon Nitride: Part I, Experimental Observations
a a a b c c c c |
Author keywords
[No Author keywords available]
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Indexed keywords
CAVITATION;
CERAMIC MATERIALS;
CRACK PROPAGATION;
CREEP;
CREEP TESTING;
GRAIN BOUNDARIES;
MECHANICAL VARIABLES MEASUREMENT;
SCANNING ELECTRON MICROSCOPY;
STRESSES;
TENSILE TESTING;
THERMAL EFFECTS;
TRANSMISSION ELECTRON MICROSCOPY;
FRACTOGRAPHY;
HIGH TEMPERATURE CONTACT PROBE EXTENSOMETRY;
LENTICULAR CAVITY FORMATION;
MONKMAN GRANT LINES;
STRESS RUPTURE;
SILICON NITRIDE;
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EID: 0028442069
PISSN: 00027820
EISSN: 15512916
Source Type: Journal
DOI: 10.1111/j.1151-2916.1994.tb05395.x Document Type: Article |
Times cited : (97)
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References (19)
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