Thermal Stability Limits of Thin TiSi2: Effect on Submicron Line Resistance and Shallow Junction Leakage

Journal of the Electrochemical Society

Volumn 141, Issue 5, 1994, Pages 1351-1356

  Baiocchi, F A ^a   Nakahara, S ^a   Ha, N T ^a   Georgiou, G E ^a   Abiko, H ^b  

^a LUCENT TECHNOLOGIES   (United States)

^b NEC CORPORATION   (Japan)

Author keywords

crystal microstructure; electric properties leakage currents; high temperature effects integrated circuit technology; p n junctions; thin films

Indexed keywords

AGGLOMERATION; ANNEALING; ELECTRIC RESISTANCE; METALLOGRAPHIC MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR JUNCTIONS; SINTERING; SPECTROSCOPIC ANALYSIS; THERMODYNAMIC STABILITY; THICKNESS MEASUREMENT; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

RUTHERFORD BACKSCATTERING SPECTROSCOPY; SHALLOW JUNCTION LEAKAGE; SILICIDE STABILITY; SUBMICRON LINE RESISTANCE; THERMAL STABILITY LIMIT;

TITANIUM COMPOUNDS;

EID: 0028436587     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/1.2054922     Document Type: Article

References (10)

1. T. Morimoto, H. S. Momose, Y. Ozawa, K. Yamabe, and H. Iwai, IEDM Tech. Dig., p. 429 (1990).
2. J. Brews, in High Speed Semiconductor Devices, S. M. Sze, Editor, pp. 141-143, Wiley-Interscience, New York (1990).
3. C. L. Chu, K. C. Saraswat, and S. S. Wong, IEDM Tech. Dig., p. 245 (1990).
4. D. C. Chen, T. Cass, J. E. Turner, P P Merchant, and K. G. Chiu, IEEE Trans. Electron Devices, ED-33, 1463 (1986).
5. S. Ogawa, T. Yoshida, and T. Kouzaki, Appl. Phys. Lett., 56, 725 (1990).
6. C. Y. Ting, F. M. D'Heurle, S. S. Iyer, and P. M. Fryer, Journal of the Electrochemical Society, 133, 2621 (1986).
7. S. A. Eshraghi, G. E. Georgiou, N. T. Ha, S. Nakahara and R. Liu, Journal of the Electrochemical Society, 139, 3648 (1992).
8. G. E. Georgiou, S. A. Eshraghi, N. T. Ha, S. Nakahara, and R. Liu, Journal of the Electrochemical Society, 139, 3644 (1992).
9. H. Sumi, T. Nishima, Y. Sugano, H. Masuya, and M. Takasu, IEDM Tech. Dig., p. 249 (1990).
10. G. E. Georgiou, F. A. Baiocchi, S. A. Eshraghi, N. T. Ha, R. Key, S. Nakahara, and M. R. Baker, in Proceedings on VLSI Multilevel Interconnection Conference, p. 308, IEEE (1993).