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Volumn 41, Issue 5, 1994, Pages 721-725

A Flat-Aluminum Based Voltage-Programmable Link for Field-Programmable Devices

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; CAPACITANCE; CAPACITORS; CHEMICAL VAPOR DEPOSITION; ELECTRIC INSULATORS; LOGIC GATES; METALLIC FILMS; METALLIZING; SEMICONDUCTOR DEVICE STRUCTURES; SILICA; SILICON NITRIDE; TITANIUM;

EID: 0028427981     PISSN: 00189383     EISSN: 15579646     Source Type: Journal    
DOI: 10.1109/16.285023     Document Type: Article
Times cited : (6)

References (8)
  • 4
    • 0026912595 scopus 로고
    • A novel double-metal structure for voltage-programmable links
    • S. S. Cohen, J. I. Raffel, and P. W. Wyatt, “A novel double-metal structure for voltage-programmable links,” IEEE Electron Dev. Lett., vol. 13, p. 488, 1992.
    • (1992) IEEE Electron Dev. Lett. , vol.13 , pp. 488
    • Cohen, S.S.1    Raffel, J.I.2    Wyatt, P.W.3
  • 5
    • 0022221751 scopus 로고
    • An evaluation of titanium interlayered aluminum films for VLSI metallization
    • B. W. Shen, T. Bonifield, and J. McPherson, “An evaluation of titanium interlayered aluminum films for VLSI metallization,” Proc. 2nd Iit. IEEE VMIC, 1985, p. 114.
    • (1985) Proc. 2nd Iit. IEEE VMIC , pp. 114
    • Shen, B.W.1    Bonifield, T.2    McPherson, J.3
  • 6
    • 0001507090 scopus 로고
    • Layered and homogeneous films of aluminum and aluminum/silicon with titanium and tungsten for multilevel interconnects
    • D. S. Gardner, T. L. Michalka, K. C. Saraswat, T. W. Barbee, Jr., J. P. Mcvittie, and J. D. Meindl, “Layered and homogeneous films of aluminum and aluminum/silicon with titanium and tungsten for multilevel interconnects,” IEEE Trans. Electron Devices, vol. ED-32, p. 174, 1985.
    • (1985) IEEE Trans. Electron Devices , vol.ED-32 , pp. 174
    • Gardner, D.S.1    Michalka, T.L.2    Saraswat, K.C.3    Barbee, T.W.4    Mcvittie, J.P.5    Meindl, J.D.6


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.