-
1
-
-
0016884543
-
Two-dimensional carrier flow in a transistor structure under nonisothermal conditions
-
S. P. Gaur and D. H. Navon, “Two-dimensional carrier flow in a transistor structure under nonisothermal conditions,” IEEE Trans. Electron Devices, vol. ED-23, pp. 50–57, 1976.
-
(1976)
IEEE Trans. Electron Devices
, vol.ED-23
, pp. 50-57
-
-
Gaur, S.P.1
Navon, D.H.2
-
2
-
-
84941516002
-
Electrical and thermal modeling of power semiconductor devices using numerical methods
-
Ph.D. dissertation, University of Liverpool, United Kingdom
-
P. Walker, “Electrical and thermal modeling of power semiconductor devices using numerical methods,” Ph.D. dissertation, University of Liverpool, United Kingdom, 1988.
-
(1988)
-
-
Walker, P.1
-
3
-
-
0026390923
-
Electrothermal simulation of power semiconductor devices
-
Baltimore, MD
-
P. A. Gough, P. Walker, and K. R. Whight, “Electrothermal simulation of power semiconductor devices,” in Proc. 3rd Int. Symp. on Power Semiconductor Devices and ICs (ISPSD ‘91), Baltimore, MD, 1991, pp. 89–94.
-
(1991)
Proc. 3rd Int. Symp. on Power Semiconductor Devices and ICs (ISPSD91)
, pp. 89-94
-
-
Gough, P.A.1
Walker, P.2
Whight, K.R.3
-
4
-
-
84941520895
-
Self-consistent simulation of heat generation and conduction in semiconductor devices
-
Ljubljana, Yugoslavia
-
P. Dickinger, G. Nanz, and S. Selberherr, “Self-consistent simulation of heat generation and conduction in semiconductor devices,” in Proc. 18th Yugoslav Conf. Microelectronics MIEL-90, Ljubljana, Yugoslavia, 1990, pp. 157–160.
-
(1990)
Proc. 18th Yugoslav Conf. Microelectronics MIEL-90
, pp. 157-160
-
-
Dickinger, P.1
Nanz, G.2
Selberherr, S.3
-
5
-
-
84941509894
-
Three-dimensional, self-consistent modeling of MOS devices under nonisothermal regime
-
W. Fichtner and D. Aemmes, eds. Konstanz, Germany: Hartung-Gorre Verlag
-
P. Ciampolini, A. Pierantoni, and G. Baccarani, “Three-dimensional, self-consistent modeling of MOS devices under nonisothermal regime,” in Simulation of Semiconductor Devices and Processes, vol. 4, W. Fichtner and D. Aemmes, eds. Konstanz, Germany: Hartung-Gorre Verlag, 1991, pp. 149–156.
-
(1991)
Simulation of Semiconductor Devices and Processes
, vol.4
, pp. 149-156
-
-
Ciampolini, P.1
Pierantoni, A.2
Baccarani, G.3
-
6
-
-
9744254298
-
Simulating temperature effects in multi-dimensional silicon devices with generalized boundary conditions
-
W. Fichtner and D. Aemmes, eds. Konstanz, Germany: Hartung-Gorre Verlag
-
K. Kells, S. Müller, W. Fichtner, and G. Wachutka, “Simulating temperature effects in multi-dimensional silicon devices with generalized boundary conditions,” in Simulation of Semiconductor Devices and Processes, vol. 4, W. Fichtner and D. Aemmes, eds. Konstanz, Germany: Hartung-Gorre Verlag, 1991, pp. 141–148.
-
(1991)
Simulation of Semiconductor Devices and Processes
, vol.4
, pp. 141-148
-
-
Kells, K.1
Miller, S.2
Fichtner, W.3
Wachutka, G.4
-
7
-
-
4243768766
-
Electrothermal simulation tools for analysis and design of ESD protection devices
-
Washington, DC
-
K. Mayaram, J. H. Chern, L. Arledge, and P. Yang, “Electrothermal simulation tools for analysis and design of ESD protection devices,” in IEDM Tech. Dig, Washington, DC, 1991, pp. 909–912.
-
(1991)
IEDM Tech. Dig
, pp. 909-912
-
-
Mayaram, K.1
Chern, J.H.2
Arledge, L.3
Yang, P.4
-
8
-
-
0022756845
-
Thermal properties of the Burrus-type light-emitting diode
-
W. Nakwaski, “Thermal properties of the Burrus-type light-emitting diode,” IEEE Trans. Electron Devices, vol. ED-33, pp. 889–907, 1986.
-
(1986)
IEEE Trans. Electron Devices
, vol.ED-33
, pp. 889-907
-
-
Nakwaski, W.1
-
9
-
-
0020829017
-
Modeling thermal effects on MOS I-V characteristics
-
D. K. Sharma and K. V. Ramanathan, “Modeling thermal effects on MOS I-V characteristics,” IEEE Electron Dev. Lett, vol. EDL-4, pp. 362–364, 1983.
-
(1983)
IEEE Electron Dev. Lett
, vol.EDL-4
, pp. 362-364
-
-
Sharma, D.K.1
Ramanathan, K.V.2
-
10
-
-
0017908416
-
Accurate calculations of the forward drop and power dissipation in thyristors
-
M. S. Adler, “Accurate calculations of the forward drop and power dissipation in thyristors,” IEEE Trans. Electron Devices, vol. ED-25, pp. 16–22, 1978.
-
(1978)
IEEE Trans. Electron Devices
, vol.ED-25
, pp. 16-22
-
-
Adler, M.S.1
-
11
-
-
0018445592
-
A computer-aided analysis of one-dimensional dimensional thermal transients in n-p-n power transistors
-
A. Chryssafis and W. Love, “A computer-aided analysis of one-dimensional dimensional thermal transients in n-p-n power transistors,” Solid-State Electronics, vol. 22, 249–256, 1979.
-
(1979)
Solid-State Electronics
, vol.22
, pp. 249-256
-
-
Chryssafis, A.1
Love, W.2
-
12
-
-
84915914476
-
Modeling of EOS in silicon devices
-
Sept.
-
N. Kusnezov and J. Smith, “Modeling of EOS in silicon devices,” in Proc. EOS/ESD Symp., Sept. 1979, pp. 132–138.
-
(1979)
Proc. EOS/ESD Symp
, pp. 132-138
-
-
Kusnezov, N.1
Smith, J.2
-
13
-
-
0021409712
-
Temperature distribution and power dissipation in MOSFETs
-
A. Schütz, S. Selberherr, and H. W. Pötzl, “Temperature distribution and power dissipation in MOSFETs,” Solid-State Electronics, vol. 27, no. 4, pp. 394–395, 1984.
-
(1984)
Solid-State Electronics
, vol.27
, Issue.4
, pp. 394-395
-
-
Schtz, A.1
Selberherr, S.2
Potzl, H.W.3
-
14
-
-
0021386255
-
A study of GTO turn-off failure mechanisms
-
A. Nakagawa and H. Ohashi, “A study of GTO turn-off failure mechanisms,” IEEE Trans. Electron Devices, vol. ED-31, pp. 273–279, 1984.
-
(1984)
IEEE Trans. Electron Devices
, vol.ED-31
, pp. 273-279
-
-
Nakagawa, A.1
Ohashi, H.2
-
15
-
-
0021483224
-
A time and temperature-dependent 2-D simulation of the GTO thyristor turn-off process
-
A. Nakagawa and D. H. Navon, “A time and temperature-dependent 2-D simulation of the GTO thyristor turn-off process,” IEEE Trans. Electron Devices, vol. ED-31, pp. 1156–1163, 1984.
-
(1984)
IEEE Trans. Electron Devices
, vol.ED-31
, pp. 1156-1163
-
-
Nakagawa, A.1
Navon, D.H.2
-
16
-
-
0022100041
-
A time and temperature-dependent two-dimensional simulation of the GTO thyristor turn-off process, II Inductive load case
-
A Nakagawa, “A time and temperature-dependent two-dimensional simulation of the GTO thyristor turn-off process, II—Inductive load case,” Solid-State Electronics, vol. 28, pp. 677–687, 1985.
-
(1985)
Solid-State Electronics
, vol.28
, pp. 677-687
-
-
Nakagawa, A.1
-
17
-
-
0022118289
-
Two-dimensional numerical analysis of the turn-off process in a GTO under inductive load
-
H. Fukui and T. Yaginuma, “Two-dimensional numerical analysis of the turn-off process in a GTO under inductive load,” IEEE Trans. Electron Devices, vol. ED-32, pp. 1830–1834, 1985.
-
(1985)
IEEE Trans. Electron Devices
, vol.ED-32
, pp. 1830-1834
-
-
Fukui, H.1
Yaginuma, T.2
-
18
-
-
84941488825
-
Electrical and thermal analysis of VLSI contacts and vias
-
Bologn Italy: Tecnoprint
-
A. Nathan, W. Allegretto, K. Chau, and H. P. Baltes, “Electrical and thermal analysis of VLSI contacts and vias,” in Simulation of Semiconductor Devices and Processes (SISDEP), vol. 3. Bologna, Italy: Tecnoprint, 1988, pp. 589–598.
-
(1988)
Simulation of Semiconductor Devices and Processes (SISDEP)
, vol.3
, pp. 589-598
-
-
Nathan, A.1
Allegretto, W.2
Chau, K.3
Baltes, H.P.4
-
19
-
-
0343650005
-
Self-heating and temperature measurement in sub-m MOSFETs
-
P. G. Mautry and J. Trager, “Self-heating and temperature measurement in sub-μ MOSFETs,” in ESSDERC 89 Tech. Dig., 1989, pp. 675–678.
-
(1989)
ESSDERC 89 Tech. Dig
, pp. 675-678
-
-
Mautry, P.G.1
Trager, J.2
-
20
-
-
0026260665
-
Measurement of transient heating in a 1.1m PMOSFET using thermal imaging
-
N. Haik, D. Gat, R. Sadon, and Y. Nissan-Cohen, “Measurement of transient heating in a 1.1 μm PMOSFET using thermal imaging,” IEEE Electron Device Letters, vol. EDL-12, pp. 611–613, 1991.
-
(1991)
IEEE Electron Device Letters
, vol.EDL-12
, pp. 611-613
-
-
Haik, N.1
Gat, D.2
Sadon, R.3
Nissan-Cohen, Y.4
-
21
-
-
0342344817
-
Thin SIMOX SOI material for half-micron CMOS
-
H. Lifka and P. H. Woerlee, “Thin SIMOX SOI material for half-micron CMOS,” in ESSDERC 90 Tech. Dig., 1990, pp. 453–456.
-
(1990)
ESSDERC 90 Tech. Dig
, pp. 453-456
-
-
Lifka, H.1
Woerlee, P.H.2
-
22
-
-
84907842571
-
Investigations of GaAs/AlGaAs quantum well lasers by micro raman spectroscopy
-
S. Beeck et al., “Investigations of GaAs/AlGaAs quantum well lasers by micro raman spectroscopy,” in ESSDERC-89 Tech. Dig., 1989.
-
(1989)
ESSDERC-89 Tech. Dig
-
-
Beeck, S.1
-
23
-
-
0001527266
-
Mapping of local temperatures on mirrors of GaAs/AlGaAs laser diodes
-
H. Brugge and P. W. Epperlein, “Mapping of local temperatures on mirrors of GaAs/AlGaAs laser diodes,” Appl. Phys. Lett., vol. 56, pp. 1049–1051, 1990.
-
(1990)
Appl. Phys. Lett
, vol.56
, pp. 1049-1051
-
-
Brugge, H.1
Epperlein, P.W.2
-
24
-
-
0025510574
-
Review of physical models for numerical simulation of semiconductor sensors
-
A. Nathan, H. Baltes, and W. Allegretto, “Review of physical models for numerical simulation of semiconductor sensors,” IEEE Trans. Electron Devices, vol. 9, pp. 1198–1208, 1990.
-
(1990)
IEEE Trans. Electron Devices
, vol.9
, pp. 1198-1208
-
-
Nathan, A.1
Baltes, H.2
Allegretto, W.3
-
25
-
-
0022813826
-
Thermal sensors based on the Seebeck effect
-
A. W. van Herwaarden and P. M. Sarro, “Thermal sensors based on the Seebeck effect,” Sensors and Actuators vol. 10, pp. 321–346, 1986.
-
(1986)
Sensors and Actuators
, vol.10
, pp. 321-346
-
-
van Herwaarden, A.W.1
Sarro, P.M.2
-
26
-
-
0021393117
-
Asymmetric Joule heat production at a point contact
-
U. Gerlach-Meyer, “Asymmetric Joule heat production at a point contact,” Appl. Phys., vol. A33, pp. 161–165, 1984.
-
(1984)
Appl. Phys
, vol.A33
, pp. 161-165
-
-
Gerlach-Meyer, U.1
-
27
-
-
0005485224
-
Thermomechanical microtransducers by CMOS technology combined with micromachining
-
R. Krahn and H. Reichl, eds. Berlin, Germany: VDE-Verlag
-
H. Baltes, D. Moser, R. Lenggenhager, O. Brand, and G. Wachutka, “Thermomechanical microtransducers by CMOS technology combined with micromachining,” in Microsystem Technologies 91, R. Krahn and H. Reichl, eds. Berlin, Germany: VDE-Verlag, 1991, pp. 98–103.
-
(1991)
Microsystem Technologies 91
, pp. 98-103
-
-
Baltes, H.1
Moser, D.2
Lenggenhager, R.3
Brand, O.4
Wachutka, G.5
-
28
-
-
0026155334
-
Thermal effects in magnetic microsensor crosensor modeling
-
S. Rudin, G. Wachutka, and H. Bakes, “Thermal effects in magnetic microsensor crosensor modeling,” Sensors and Actuators, vol. A25-27, pp. 731–735, 1991.
-
(1991)
Sensors and Actuators
, vol.A25-27
, pp. 731-735
-
-
Rudin, S.1
Wachutka, G.2
Bakes, H.3
-
29
-
-
84941519504
-
IMPACT 1-2-3, an integrated 2-D process/device simulator for M.O.S. technology
-
W. Crans, ed. Dublin, Ireland: Boole Press
-
D. Collard, B. Baccus, and E. Dubois, “IMPACT 1-2-3, an integrated 2-D process/device simulator for M.O.S. technology,” in Software Tools for Process, Device and Circuit Modeling, W. Crans, ed. Dublin, Ireland: Boole Press, 1989, pp. 16–31.
-
(1989)
Software Tools for Process, Device and Circuit Modeling
-
-
Collard, D.1
Baccus, B.2
Dubois, E.3
-
30
-
-
0040590367
-
TITAN 5, A two-dimensional process and device simulator
-
W. Crans, ed. Dublin, Ireland: Boole Press
-
A. Gerodolle, C. Corbex, A. Poncet, T. Pédron, and S. Martin, “TITAN 5, A two-dimensional process and device simulator,” in Software Tools for Process, Device and Circuit Modeling, W. Crans, ed. Dublin, Ireland: Boole Press, 1989, pp. 56–67.
-
(1989)
Software Tools for Process, Device and Circuit Modeling
, pp. 56-67
-
-
Gerodolle, A.1
Corbex, C.2
Poncet, A.3
Pedron, T.4
Martin, S.5
-
31
-
-
0014705867
-
Transport equations for electrons in two-valley semiconductors
-
K. Bio tekjaer, “Transport equations for electrons in two-valley semiconductors,” IEEE Trans. Electron Devices, vol. ED-17, pp. 38–47, 1970.
-
(1970)
IEEE Trans. Electron Devices
, vol.ED-17
, pp. 38-47
-
-
Bio tekjaer, K.1
-
32
-
-
0000854076
-
The automatic integration of stiff ordinary differential equations
-
Amsterdam: North-Holland
-
C. W. Gear, “The automatic integration of stiff ordinary differential equations,” in Information Processing 68. Amsterdam: North-Holland, 1969.
-
(1969)
Information Processing
, vol.68
-
-
Gear, C.W.1
-
33
-
-
0015027667
-
The automatic integration of ordinary differential equations
-
C. W. Gear, “The automatic integration of ordinary differential equations,” Communications of the ACM, vol. 14, no. 3, pp. 176–179, 1971.
-
(1971)
Communications of the ACM
, vol.14
, Issue.3
, pp. 176-179
-
-
Gear, C.W.1
-
34
-
-
33747278220
-
Modeling and simulation of semiconductor devices in TRENDY: Electrical, thermal and hydrodynamic behavior
-
Ph.D. dissertation, University of Twente, Enschede, The Netherlands
-
P. B. M. Wolbert, “Modeling and simulation of semiconductor devices in TRENDY: Electrical, thermal and hydrodynamic behavior,” Ph.D. dissertation, University of Twente, Enschede, The Netherlands, 1991.
-
(1991)
-
-
Wolbert, P.B.M.1
-
35
-
-
0344204631
-
Multigrid bibliography
-
S. F. McCormick, ed. Philadelphia, PA: SIAM
-
K. Brand, M. Lenke, and J. Linden, “Multigrid bibliography,” in Multigrid Methods, Frontiers in Applied Mathematics, vol. 3, S. F. McCormick, ed. Philadelphia, PA: SIAM, 1987.
-
(1987)
Multigrid Methods, Frontiers in Applied Mathematics
, vol.3
-
-
Brand, K.1
Lenke, M.2
Linden, J.3
-
36
-
-
6044253052
-
Multigrid methods semiconductor device simulation
-
Ph.D. dissertation, Centre for Mathematics and Computer Science, Amsterdam, The Netherlands
-
J. Molenaar, “Multigrid methods semiconductor device simulation,” Ph.D. dissertation, Centre for Mathematics and Computer Science, Amsterdam, The Netherlands, 1992.
-
(1992)
-
-
Molenaar, J.1
-
37
-
-
0000005482
-
BI-CGSTAB: A fast and smoothly converging variant of BI-CG for the solution of nonsymmetric linear systems
-
H. A. van der Vorst, “BI-CGSTAB: A fast and smoothly converging variant of BI-CG for the solution of nonsymmetric linear systems,” SIAM J. Sci. Statist. Comput., vol. 13, no. 2, 1992.
-
(1992)
SIAM J. Sci. Statist. Comput
, vol.13
, Issue.2
-
-
vander Vorst, H.A.1
-
38
-
-
0026238698
-
Three-dimensional numerical semiconductor device simulation: Algorithms, architectures, results
-
G. Heiser, C. Pommerel, J. Weiss, and W. Fichtner, “Three-dimensional numerical semiconductor device simulation: Algorithms, architectures, results,” IEEE Trans. Computer-Aided Design, vol. 10, pp. 1218–1230, 1991.
-
(1991)
IEEE Trans. Computer-Aided Design
, vol.10
, pp. 1218-1230
-
-
Heiser, G.1
Pommerel, C.2
Weiss, J.3
Fichtner, W.4
-
39
-
-
0025512595
-
Rigorous thermodynamic treatment of heat generation and conduction in semiconductor device modeling
-
G. K. Wachutka, “Rigorous thermodynamic treatment of heat generation and conduction in semiconductor device modeling,” IEEE Trans. Computer-Aided Design, vol. 9, pp. 1141–1149, 1990.
-
(1990)
IEEE Trans. Computer-Aided Design
, vol.9
, pp. 1141-1149
-
-
Wachutka, G.K.1
-
40
-
-
0026371563
-
Unified framework for thermal, electrical, magnetic, and optical semiconductor device modeling
-
G. K. Wachutka, “Unified framework for thermal, electrical, magnetic, and optical semiconductor device modeling,” COMPEL, vol. 10, pp. 311–322, 1991.
-
(1991)
COMPEL
, vol.10
, pp. 311-322
-
-
Wachutka, G.K.1
-
41
-
-
0003839611
-
SEDAN-III-A generalized electronic material device analysis program
-
Stanford Electronics Lab, Stanford Univ., July
-
Z. Yu and R. W. Dutton, “SEDAN-III-A generalized electronic material device analysis program,” Tech. Rep., Stanford Electronics Lab, Stanford Univ., July 1985.
-
(1985)
Tech. Rep
-
-
Yu, Z.1
Dutton, R.W.2
-
42
-
-
0038256751
-
Bandgap narrowing in silicon bipolar transistors
-
J. W. Slotboom and H. C. de Graaff, “Bandgap narrowing in silicon bipolar transistors,” IEEE Trans. Electron Devices, vol. ED-24, pp. 1123–1125, 1977.
-
(1977)
IEEE Trans. Electron Devices
, vol.ED-24
, pp. 1123-1125
-
-
Slotboom, J.W.1
de, H.C.2
-
43
-
-
36149007454
-
Seebeck effect in silicon
-
T. H. Geballe and G. W. Hull, “Seebeck effect in silicon,” Phys. Rev., vol. 98, pp. 940–947, 1955.
-
(1955)
Phys. Rev
, vol.98
, pp. 940-947
-
-
Geballe, T.H.1
Hull, G.W.2
-
44
-
-
0014744577
-
Thermal conductivity and thermoelectric power of heavily doped n-type silicon
-
M. E. Brinson and W. Dunstan, “Thermal conductivity and thermoelectric power of heavily doped n-type silicon,” J. Phys., vol. C3, pp. 483–491, 1970.
-
(1970)
J. Phys
, vol.C3
, pp. 483-491
-
-
Brinson, M.E.1
Dunstan, W.2
-
45
-
-
36149028246
-
Theory of the thermoelectric power of semiconductors
-
C. Herring, “Theory of the thermoelectric power of semiconductors,” Phys. Rev., vol. 96, pp. 1163–1187, 1954.
-
(1954)
Phys. Rev
, vol.96
, pp. 1163-1187
-
-
Herring, C.1
-
46
-
-
0003624373
-
-
Berlin, Germany: Springer Verlag
-
K. Seeger, Semiconductor Physics. Berlin, Germany: Springer Verlag, 1982, p. 81.
-
(1982)
Semiconductor Physics
, pp. 81
-
-
Seeger, K.1
-
47
-
-
0015489215
-
Semiconductor current-flow equations (diffusion and degeneracy)
-
R. Stratton, “Semiconductor current-flow equations (diffusion and degeneracy),” IEEE Trans. Electron Devices, vol. ED-19, pp. 1288–1292, 1972.
-
(1972)
IEEE Trans. Electron Devices
, vol.ED-19
, pp. 1288-1292
-
-
Stratton, R.1
-
48
-
-
48749147377
-
On electrical transport in nonisothermal semiconductors
-
J. M. Dorkel, “On electrical transport in nonisothermal semiconductors,” Solid-State Electronics, vol. 6, 819–821, 1983.
-
(1983)
Solid-State Electronics
, vol.6
, pp. 819-821
-
-
Dorkel, J.M.1
-
49
-
-
84916389355
-
Large-signal analysis of a silicon read diode oscillator
-
D. Scharfetter and H. K. Gummel, “Large-signal analysis of a silicon read diode oscillator,” IEEE Trans. Electron Devices, vol. ED-16, pp. 64–77, 1969.
-
(1969)
IEEE Trans. Electron Devices
, vol.ED-16
, pp. 64-77
-
-
Scharfetter, D.1
Gummel, H.K.2
-
50
-
-
36149005932
-
Thermal conductivity of silicon and germanium from 3K to melting point
-
C. J. Glassbrenner and G. A. Slack, “Thermal conductivity of silicon and germanium from 3K to melting point,” Phys. Rev., vol. 134, no. 4A, pp. 1058–1069, 1964.
-
(1964)
Phys. Rev
, vol.134
, Issue.4A
, pp. 1058-1069
-
-
Glassbrenner, C.J.1
Slack, G.A.2
-
53
-
-
84908846392
-
TRENDY: An integrated program for IC process and device simulation
-
Ph.D. dissertation, Univ. of Twente, Enschede, The Netherlands
-
E. van Schie, “TRENDY: An integrated program for IC process and device simulation,” Ph.D. dissertation, Univ. of Twente, Enschede, The Netherlands, 1990.
-
(1990)
-
-
van Schie, E.1
-
54
-
-
0003808119
-
-
Moscow, Russia: MIR Publishers, Publishers
-
P. S. Kireev, Semiconductor Physics. Moscow, Russia: MIR Publishers, 1978.
-
(1978)
Semiconductor Physics
-
-
Kireev, P.S.1
-
55
-
-
0015673363
-
Electron and hole ionization rates in epitaxial silicon at high electric fields
-
W. N. Grant, “Electron and hole ionization rates in epitaxial silicon at high electric fields,” Solid-State Electronics, vol. 16, no. 10, pp. 1189–1203, 1973.
-
(1973)
Solid-State Electronics
, vol.16
, Issue.10
, pp. 1189-1203
-
-
Grant, W.N.1
|