Experimental study of the mechanisms of brittle-to-ductile transition of cleavage fracture in Si single crystals

Materials Science and Engineering A

Volumn 176, Issue 1-2, 1994, Pages 111-119

  Hsia, K J ^a   Argon, A S ^b  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^b MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; CRYSTALS; DISLOCATIONS (CRYSTALS); FRACTURE; FRACTURE MECHANICS; MATERIALS SCIENCE;

BRITTLE TO DUCTILE TRANSITION; CLEAVAGE FRACTURE; CRACK ARREST TEMPERATURE; CRACK VELOCITY; DISLOCATION MOBILITY; ETCH PITTING; SINGLE CRYSTALS;

SILICON;

EID: 0028396902     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/0921-5093(94)90964-4     Document Type: Article

References (22)

1. The size of a dislocation
2. The Brittle-Ductile Transition in Silicon. II. Interpretation
3. The brittle-to-ductile transition in pre-cleaved silicon single crystals
4. The Brittle-Ductile Transition in Silicon. I. Experiments
5. Direct observation of dislocation emission from crack tips in silicon at high temperatures