Metal Distribution in Jet Plating

Journal of the Electrochemical Society

Volumn 141, Issue 3, 1994, Pages 691-697

  Karakus, C ^a   Chin, D T ^a  

^a Clarkson University ^*  (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER PLATING; ELECTROLYTIC CELLS; ELECTROPLATING; NICKEL PLATING;

CATHODE SURFACE; CURRENT DENSITY; ELECTROLYTE VELOCITY; HIGH SPEED ELECTROPLATING; JET PLATING; METAL THICKNESS DISTRIBUTION;

ELECTRODEPOSITION;

EID: 0028388538     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/1.2054793     Document Type: Article

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