Intermetallic Compounds At Aluminum-To-Copper Electrical Interfaces: Effect of Temperature And Electric Current

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 17, Issue 1, 1994, Pages 78-85

  Braunovic M ^a   Alexandrov, N ^a  

^a HYDRO QUÉBEC   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COMPOSITION; COPPER; ELECTRIC CURRENTS; ELECTRIC FIELD EFFECTS; ELECTRIC RESISTANCE; GROWTH (MATERIALS); HARDNESS; INTERFACES (MATERIALS); INTERMETALLICS; STABILITY; THERMAL EFFECTS;

CHEMICAL COMPOSITION; ELECTRIC CURRENT EFFECT; ELECTRICAL INTERFACE; FORMATION KINETICS; FRICTION WELDED ALUMINUM TO COPPER; MICROHARDNESS; TIN PLATED COPPER CONDUCTOR;

ELECTRIC CONDUCTORS;

EID: 0028385973     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.296372     Document Type: Article

References (12)

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