Physical Scaling and Interconnection Delays in Multichip Modules

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 17, Issue 1, 1994, Pages 30-37

  Frye, Robert C ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; MICROPROCESSOR CHIPS;

ADVANCED PACKAGING; INTERCONNECTING STRUCTURES; MULTICHIP MODULES; PACKAGING DENSITY;

CMOS INTEGRATED CIRCUITS;

EID: 0028377233     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.296428     Document Type: Article

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