Optimum accelerated life tests wth a nonconstant scale parameter

Technometrics

Volumn 36, Issue 1, 1994, Pages 71-83

  Meeter, Carol A ^a   Meeker, William Q ^b  

^a 3M COMPANY   (United States)

^b IOWA STATE UNIVERSITY   (United States)

Author keywords

Censored data; Experimental design; Life data analysis; Life test planning; Reliability; Weibull distribution

Indexed keywords

FAILURE (MECHANICAL); FATIGUE OF MATERIALS; FRACTURE MECHANICS; METAL TESTING; SERVICE LIFE; STRESSES;

ACCELERATED LIFE TESTS; METAL FATIGUE TESTS;

MATERIALS TESTING;

EID: 0028374805     PISSN: 00401706     EISSN: 15372723     Source Type: Journal    
DOI: 10.1080/00401706.1994.10485402     Document Type: Article

References (25)

1. Barton, R. R. (1991), “Optimal Accelerated Life-time Plans That Minimize the Maximum Test-Stress,” IEEE Transactions on Reliability, 40, 166-192.
2. Boyko, K. C., and Gerlach, D. L. (1989), “Times Dependent Dielectric Breakdown of 210ÅOxides; in Proceedings of the 1989 Reliability Physics Symposium, New York: IEEE, pp.1-8.
3. Chaloner, K., and Larntz, K. (1992), “Bayesian Design for Accelerated Life Testing,” Journal of Statistical Planning and Inference, 33, 245-259.
4. Chan, C. K. (1991), “Temperature-Dependent Standard Deviation of Log (Failure Time) Distributions,” IEEE Transactions on Reliability, 40, 157-160.
5. Chernoff, H. (1962), “Optimal Accelerated Life Designs for Estimation,” Technometrics, 4, 381-408.
6. Escobar, L. A., and Meeker, W. Q., Jr. (in press), “Fisher Information Matrix for the Extreme Value, Normal, and Logistic Distributions and Censored Data,” Applied Statistics, 43 or 44.
7. Glaser, R. E. (1984), “Estimation for a Weibull Accelerated Life Test Model,” Naval Research Logistics Quarterly, 31, 559-570.
8. Hiergeist, P., Spitzer, A., and Rohl, S. (1989), “Lifetime of Thin Oxide and Oxide-Nitride-Oxide Dielectrics Within Trench Capacitors for DRAM’s,” IEEE Transactions on Electron Devices, 36, 913-919.
9. Jensen, K. L., and Meeker, W. Q. (1990), “ALTPLAN: Microcomputer Software for Developing and Evaluating Accelerated Life Test Plans,” unpublished paper presented at the Joint Statistical Meetings, Anaheim, California, August 6-9.
10. Joyce, W. B., Liou, K.-Y., Nash, F. R., Bossard, P. R., and Hartman, R. L. (1985), “Methodology of Accelerated Aging,” AT&T Technical Journal, 64, 117-164.
11. Klinger, D. J. (1992), “Failure Time and Rate Constant of Degradation: An Argument for the Inverse Relationship,” Microelectronics and Reliability, 32, 987-994.
12. Li, P. C., Ting, W., and Kwong, D. L. (1989), “Time Dependent Dielectric Breakdown of Chemical-Vapour-Deposited SiO, Gate Dielectrics,” Electronic Letters, 25, 665-666.
13. McPherson, J. W., and Baglee, D. A. (1985), “Acceleration Factors for Thin Gate Oxide Stressing,” Proceedings of the 1985 International Reliability Physics Symposium, 1-5.
14. Meeker, W. Q. (1984), “A Comparison of Accelerated Life Test Plans for Weibull and Lognormal Distributions and Type I Censored Data,” Technometrics, 26, 157-171.
15. Meeker, W. Q., and Hahn, G. J. (1985), How To Plan An Accelerated Life Test-Some Practical Guidelines (Vol. 10 in the ASQC Basic References in Quality Control: Statistical Techniques), Milwaukee, WI: American Society for Quality Control.
16. Meeker, W. Q., and Nelson, W. (1975), “Optimum Accelerated Life Tests for Weibull and Extreme Value Distributions and Censored Data,” IEEE Transactions on Reliability, 24, 321- 332.
17. Nelson, W. (1984) “Fitting of Fatigue Curves With Nonconstant Standard Deviation to Data With Runouts,” Journal of Testing and Evaluation, 12, 69-77.
18. Nelson, W. (1990), Accelerated Testing: Statistical Models, Test Plans, and Data Analyses, New York: John Wiley.
19. Nelson, W., and Kielpinski, T. J. (1975), “Optimum Accelerated Life Tests for Normal and Lognormal Life Distributions,” IEEE Transactions on Reliability, 24, 310-20.
20. Nelson, W., and Kielpinski, T. J. (1976), “Theory for Optimum Censored Accelerated Tests for Normal and Lognormal Life Distributions,” Technometrics, 18, 105-114.
21. Nelson, W., and Meeker, W. (1978), “Theory for Optimum Accelerated Life Tests for the Weibull and Extreme Value Distributions,” Technometrics, 20, 171-177.
22. Schreiber, H. U., and Grabe, B. (1981), “Electromigration Measuring Techniques for Grain Boundary Diffusion Activation Energy in Aluminum,” Solid-State Electronics, 24, 1135-1146.
23. Schwarz, J. A. (1987), “Effect of Temperature on the Variance of the Lognormal Distribution of Failure Times Due to Electromigration Damage,” Journal of Applied Physics, 61, 801- 803.
24. Schwarz, J. A., and Felton, L. E. (1985), “Compensating Effects in Electromigration Kinetics,” Solid-State Electronics, 28, 669- 675.
25. Vander Wiel, S. A., and Meeker, W. Q. (1990), “Accuracy of Approximate Confidence Bounds Using Censored Weibull Regression Data From Accelerated Life Tests,” IEEE Transactions on Reliability, 346-351.