메뉴 건너뛰기




Volumn 29, Issue 2, 1994, Pages 143-146

Electrothermal Simulation and Design of Integrated Circuits

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DESIGN; INTEGRATED CIRCUIT LAYOUT; PRINTED CIRCUIT DESIGN; SOLID STATE DEVICES;

EID: 0028371390     PISSN: 00189200     EISSN: 1558173X     Source Type: Journal    
DOI: 10.1109/4.272120     Document Type: Article
Times cited : (80)

References (23)
  • 2
    • 84939338001 scopus 로고
    • Electronic system thermal design for reliability
    • Dec.
    • R. Hannamann. “Electronic system thermal design for reliability.” Trans. Rel., Dec. 1977.
    • (1977) Trans. Rel.
    • Hannamann, R.1
  • 3
    • 0019264012 scopus 로고
    • 5 V temperature regulated voltage reference
    • Dec.
    • D. P. Laude and J. D. Beasom. “5 V temperature regulated voltage reference,” IEEE J. Solid-State Circuits, vol. SC-15, no. 12, pp. 1070-1076, Dec. 1980.
    • (1980) IEEE J. Solid-State Circuits , vol.SC-15 , Issue.12 , pp. 1070-1076
    • Laude, D.P.1    Beasom, J.D.2
  • 4
    • 0019665004 scopus 로고
    • A high-frequency temperature-stable monolithic VCO
    • Dec.
    • J. F. Kukielka and R. G. Meyer. “A high-frequency temperature-stable monolithic VCO,” IEEE J. Solid-State Circuits, vol. SC-16, no. 12, pp. 639-647, Dec. 1981.
    • (1981) IEEE J. Solid-State Circuits , vol.SC-16 , Issue.12 , pp. 639-647
    • Kukielka, J.F.1    Meyer, R.G.2
  • 5
    • 0016313596 scopus 로고
    • The monolithic op amp: A tutorial study
    • Nov.
    • J. E. Solomon. “The monolithic op amp: A tutorial study,” IEEE J. Solid-State Circuits, vol. SC-9, no.11, pp. 314-332, Nov. 1974.
    • (1974) IEEE J. Solid-State Circuits , vol.SC-9 , pp. 314-332
    • Solomon, J.E.1
  • 6
    • 0019698649 scopus 로고
    • Matching properties and voltage and temperature dependence of MOS capacitors
    • Dec.
    • J. L. McCreary. “Matching properties and voltage and temperature dependence of MOS capacitors,” IEEE J. Solid-State Circuits, vol. SC-16, no. 12, pp. 608-616. Dec. 1981.
    • (1981) IEEE J. Solid-State Circuits , vol.SC-16 , Issue.12 , pp. 608-616
    • McCreary, J.L.1
  • 7
    • 0019025611 scopus 로고
    • Three-dimensional transient thermal simulation: Application to delayed short circuit protection in power IC's
    • June
    • P. Antognetti et al., “Three-dimensional transient thermal simulation: Application to delayed short circuit protection in power IC's,” IEEE J. Solid-State Circuits, vol. SC-15, no. 6, pp. 277-282, June 1980.
    • (1980) IEEE J. Solid-State Circuits , vol.SC-15 , Issue.6 , pp. 277-282
    • Antognetti, P.1
  • 8
    • 0016048549 scopus 로고
    • Analysis and design of temperature stabilized substrate integrated circuits
    • Apr.
    • P.R. Gray et al., “Analysis and design of temperature stabilized substrate integrated circuits,” IEEE J. Solid-State Circuits, vol. SC-9, no.4, pp. 61-70, Apr. 1974.
    • (1974) IEEE J. Solid-State Circuits , vol.SC-9 , pp. 61-70
    • Gray, P.R.1
  • 9
    • 0017269965 scopus 로고
    • Computer simulation of integrated circuits in the presence of electrothermal interaction
    • Dec.
    • K. Fukahori and P. Gray, “Computer simulation of integrated circuits in the presence of electrothermal interaction,” IEEE J. Solid-State Circuits, vol. SC-11, no. 6, pp. 834-846, Dec. 1976.
    • (1976) IEEE J. Solid-State Circuits , vol.SC-11 , Issue.6 , pp. 834-846
    • Fukahori, K.1    Gray, P.2
  • 10
    • 0024666015 scopus 로고
    • Extending SPICE for electrothermal simulation
    • San Diego, May
    • R. Vogelsong and C. Brzezinski. “Extending SPICE for electrothermal simulation,” in Proc. CICC, San Diego, May 1989, pp. 21.4.1-4.
    • (1989) Proc. CICC , pp. 1-4
    • Vogelsong, R.1    Brzezinski, C.2
  • 11
    • 0016222299 scopus 로고
    • A thermal model for high power devices design
    • Washington DC, December
    • Ph. Leturcq and C. Cavalier. “A thermal model for high power devices design.” in Proc. Int. Electron. Devices Meet., Washington DC, December 1974. pp. 422-425.
    • (1974) Proc. Int. Electron. Devices Meet. , pp. 422-425
    • Leturcq, Ph.1    Cavalier, C.2
  • 12
    • 0024860043 scopus 로고
    • Thermal diagnostics of semiconductor devices
    • San Diego, Feb.
    • A. Nowakowski. -Thermal diagnostics of semiconductor devices,” in Proc. Fifth IEEE SEMI-THERM Symp., San Diego, Feb. 1989, pp. 173-178.
    • (1989) Proc. Fifth IEEE SEMI-THERM Symp. , pp. 173-178
    • Nowakowski, A.1
  • 15
    • 3843095081 scopus 로고
    • Iterative solutions to electronic problems, based on finite elements: Electrothermal simulation and electrical impedance tomography
    • Ph.D. dissertation, Katholieke Universiteit Leuven, Belgium, Sept.
    • W. Van Petegem, “Iterative solutions to electronic problems, based on finite elements: Electrothermal simulation and electrical impedance tomography,” Ph.D. dissertation, Katholieke Universiteit Leuven, Belgium, Sept. 1993.
    • (1993)
    • Van Petegem, W.1
  • 17
    • 33747620541 scopus 로고
    • Framatome+Csi, France, Mar.
    • SYSTUS User's Manual, Framatome+Csi, France, Mar. 1990.
    • (1990) SYSTUS User's Manual
  • 19
    • 84939343166 scopus 로고
    • The segmented waveform relaxation method for mixed-mode mode simulation of digital MOS VLSI circuits
    • Ph.D dissertation, Katholieke Universiteit Leuven, Belgium, Oct.
    • D. Dumlugol, “The segmented waveform relaxation method for mixed-mode mode simulation of digital MOS VLSI circuits,” Ph.D dissertation, Katholieke Universiteit Leuven, Belgium, Oct. 1986.
    • (1986)
    • Dumlugol, D.1
  • 20
    • 84926410510 scopus 로고
    • A modular BiCMOS technology including 85 V DMOS devices for analogue/digital ASIC applications
    • J. Witters, “A modular BiCMOS technology including 85 V DMOS devices for analogue/digital ASIC applications.” Microelectron. Eng., vol. 19, pp. 555-560, 1992.
    • (1992) Microelectron. Eng. , vol.19 , pp. 555-560
    • Witters, J.1
  • 22
    • 0015280355 scopus 로고
    • Steady-state junction temperatures of semiconductor chips
    • Jan.
    • R. Lindsted and R. Surty, “Steady-state junction temperatures of semiconductor chips,” IEEE Trans. Electron Devices, vol. ED-19, no. 1, pp. 41-44, Jan. 1972.
    • (1972) IEEE Trans. Electron Devices , vol.ED-19 , Issue.1 , pp. 41-44
    • Lindsted, R.1    Surty, R.2
  • 23
    • 0027133256 scopus 로고
    • A SBIMOS diode matrix for the caracterization of static and transient thermal phenomena on silicon
    • Austin, Feb.
    • B. Geeraerts, W. Van Petegem, and W. Sansen, “A SBIMOS diode matrix for the caracterization of static and transient thermal phenomena on silicon,” in Proc. Ninth IEEE SEMI-THERM Symp., Austin, Feb. 1993, pp. 108-111.
    • (1993) Proc. Ninth IEEE SEMI-THERM Symp. , pp. 108-111
    • Geeraerts, B.1    Van Petegem, W.2    Sansen, W.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.