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Volumn , Issue , 1994, Pages 138-141
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Model for thermal fatigue of large area adhesive joints between materials with dissimilar thermal expansion
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Author keywords
[No Author keywords available]
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Indexed keywords
BONDING;
CRACK PROPAGATION;
ELASTICITY;
ELECTRONICS PACKAGING;
FATIGUE OF MATERIALS;
HEAT RESISTANCE;
HEAT SINKS;
HEAT TRANSFER;
MATHEMATICAL MODELS;
THERMAL EXPANSION;
THERMAL STRESS;
BOND LAYER;
CRACK GROWTH RATE;
DIE BOND ADHESIVES;
DIE BONDS;
STRESS DISTRIBUTION;
THERMAL FATIGUE;
ADHESIVE JOINTS;
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EID: 0028342241
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (5)
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References (6)
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