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Volumn 32, Issue 1, 1994, Pages 43-70
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An experimental investigation of the electrostatic discharge (ESD) mechanism in packaged semiconductor devices
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRIC BREAKDOWN;
ELECTRIC WAVEFORMS;
ELECTRODES;
ELECTROSTATICS;
MATHEMATICAL MODELS;
PROBES;
RADIATION DAMAGE;
SCANNING ELECTRON MICROSCOPY;
SEMICONDUCTOR DEVICES;
SURFACES;
APPROACHING DISCHARGE TESTS;
DISCHARGE WAVEFORMS;
DUAL IN LINE PACKAGE;
ELECTROSTATIC DISCHARGE;
FIXED GAP DISCHARGE TESTS;
SMALL OUTLINE J-LEAD SEMICONDUCTOR DEVICE;
ELECTRIC DISCHARGES;
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EID: 0028274395
PISSN: 03043886
EISSN: None
Source Type: Journal
DOI: 10.1016/0304-3886(94)90028-0 Document Type: Article |
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Times cited : (5)
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References (28)
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