Pool boiling interactions between multiple heat sources in an array of silicon chips

Proceedings of the Intersociety Conference on Thermal Phenomena in Electronic Systems

Volumn , Issue , 1994, Pages 9-15

  Balch, Stacey E ^a   Bhavnani, Sushil H ^a   Jaeger, Richard C ^a   Bhutani, Sutikshan ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; BOILING LIQUIDS; COOLING; DIELECTRIC MATERIALS; FLUOROCARBONS; HEAT LOSSES; HEAT SINKS; HEAT TRANSFER; HEATING EQUIPMENT; MICROPROCESSOR CHIPS; SEMICONDUCTING SILICON; THIN FILMS;

DIELECTRIC FLUIDS; FLUOROCARBON FC-72; HEATERS; MICROCAVITIES; POOL BOILING; SILICON CHIPS;

ELECTRONICS PACKAGING;

EID: 0028115145     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)