Via hole, bond wire and shorting pins for multi-layered circuits

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 1994, Pages 1777-1780

  Tsai, Ming Ju ^a   Horng, Tzyy Sheng ^a   Alexopoulos, Nicolaos G ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; ELECTRIC CURRENT DISTRIBUTION MEASUREMENT; ELECTRIC FIELD MEASUREMENT; ELECTRIC WIRING; FOURIER TRANSFORMS; FREQUENCY RESPONSE; INTEGRATED CIRCUIT LAYOUT; MATHEMATICAL MODELS; MATRIX ALGEBRA; NUMERICAL METHODS; SPECTRUM ANALYSIS; THREE DIMENSIONAL;

DYADIC GREEN'S FUNCTION; PULSE FUNCTIONS;

MONOLITHIC INTEGRATED CIRCUITS;

EID: 0028101629     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)