Fine line thin dielectric circuit board characterization

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1994, Pages 564-569

  Chang, Chi Shih ^a   Agrawal, Amit P ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHARACTERIZATION; COPPER; DELAY CIRCUITS; DIELECTRIC MATERIALS; ELECTRIC IMPEDANCE; ELECTRIC LINES; ELECTRIC LOSSES; ELECTRIC RESISTANCE; ELECTRIC VARIABLES MEASUREMENT; METAL FOIL; SURFACE PROPERTIES;

CHARACTERISTIC IMPEDANCE; PROPAGATION TIME CONSTANT; RESONANT MEASUREMENT TECHNIQUE; SURFACE ROUGHNESS;

PRINTED CIRCUIT BOARDS;

EID: 0028096417     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)