Liquid encapsulant and uniaxial calibration mechanical stress measurement with the ATC04 assembly test chip

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1994, Pages 750-757

  Sweet, James N ^a   Peterson, David W ^a   Emerson, John A ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); CALIBRATION; EPOXY RESINS; MECHANICAL VARIABLES MEASUREMENT; MICROPROCESSOR CHIPS; OSCILLATORS (ELECTRONIC); SEMICONDUCTOR MATERIALS; SENSORS; SHEET MOLDING COMPOUNDS; SHRINKAGE; STRESSES; SUBSTRATES;

ASSEMBLY TEST CHIP; LIQUID ENCAPSULANT; MECHANICAL STRESS MEASUREMENT; PIEZORESISTIVE STRESS SENSING CELLS; PIEZORESISTIVE STRESS SENSORS; RESISTIVE HEATERS;

CMOS INTEGRATED CIRCUITS;

EID: 0028022266     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)