Jet impingement boiling of a dielectric coolant in narrow gaps

Proceedings of the Intersociety Conference on Thermal Phenomena in Electronic Systems

Volumn , Issue , 1994, Pages 1-8

  Chrysler, G M ^a   Chu, R C ^a   Simons, R E ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOILING LIQUIDS; CERAMIC PRODUCTS; COOLANTS; COOLING; DIELECTRIC MATERIALS; ELECTRONICS PACKAGING; FLOW OF FLUIDS; FLUOROCARBONS; HEAT TRANSFER; JETS; ORIFICES;

CHIP-TO-ORIFICE GAP; DIELECTRIC COOLANTS; FLUOROCARBON FC-72; JET IMPINGEMENT BOILING;

MICROPROCESSOR CHIPS;

EID: 0027940766     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)