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Volumn , Issue , 1994, Pages 62-72
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Numerical investigation of conjugate heat transfer from a flush heat source on a conductive board in laminar channel flow
a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
AIR;
CHANNEL FLOW;
COOLING;
HEAT CONVECTION;
LAMINAR FLOW;
MICROPROCESSOR CHIPS;
PRINTED CIRCUIT BOARDS;
SUBSTRATES;
THERMAL CONDUCTIVITY;
VELOCITY;
CONJUGATE HEAT TRANSFER;
FLUSH HEAT SOURCES;
REYNOLDS NUMBER;
ELECTRONICS PACKAGING;
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EID: 0027928471
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (10)
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References (19)
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