Picoliter solder droplet dispensing

International Journal of Microcircuits and Electronic Packaging

Volumn 16, Issue 3, 1993, Pages 173-180

  Hayes, Donald J ^a   Wallace, David B ^a   Boldman, Michael T ^a   Marusak, Ronald E ^a  

^a MICROFAB TECHNOLOGIES INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DROP FORMATION; INTEGRATED CIRCUIT MANUFACTURE; PRINTING; SURFACE PHENOMENA;

BUMPS; INK JET PRINTING; SOLDER BALLS; SOLDER DROPLETS;

SOLDERING;

EID: 0027908097     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (15)