3.5V, 1.3W GaAs power multi chip IC for cellular phone

Technical Digest - GaAs IC Symposium (Gallium Arsenide Integrated Circuit)

Volumn , Issue , 1993, Pages 53-56

  Maeda, Masahiro ^a   Nishijima, Masaaki ^a   Takehara, Hiroyasu ^a   Adachi, Chinatsu ^a   Fujimoto, Hiromasa ^a   Ota, Yorito ^a   Ishikawa, Osamu ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CELLULAR TELEPHONE SYSTEMS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; PERFORMANCE; PRINTED CIRCUIT BOARDS; PRODUCT DESIGN; SEMICONDUCTING ALUMINUM COMPOUNDS; SEMICONDUCTING GALLIUM ARSENIDE; SURFACE MOUNT TECHNOLOGY;

ALUMINUM NITRIDE; CELLULAR PHONE; MULTI CHIP INTEGRATED CIRCUITS; OUTPUT POWER; PASSIVE MATCHING CHIPS;

MESFET DEVICES;

EID: 0027883987     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)