Influence of Air Pressure on Resonating and Thermoelectric Microstructures Realized with Standard IC Technologies

Technical Digest - International Electron Devices Meeting, IEDM

Volumn , Issue , 1993, Pages 195-198

  Brand, O ^a   Lenggenhager, R ^a   Bakes, H ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

DIAPHRAGMS; PRESSURE SENSORS; RESONATORS; TIMING CIRCUITS; BIPOLAR INTEGRATED CIRCUITS; ETCHING; PRESSURE GAGES; THERMOCOUPLES;

AIR-PRESSURE; CANTILEVER BEAM RESONATORS; CMOS IC; FREQUENCY FACTORS; FUNDAMENTAL RESONANCE FREQUENCY; IC TECHNOLOGY; MEASUREMENT RANGE; RESONANT BEAMS; THERMOELECTRIC; THERMOELECTRIC MICROSTRUCTURE;

ATMOSPHERIC PRESSURE; CMOS INTEGRATED CIRCUITS;

AIR PRESSURE; RESONANT BEAM; THERMOELECTRIC MICROSTRUCTURES;

EID: 0027878003     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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