Mechanism Of Resist Pattern Collapse During Development Process

Japanese Journal of Applied Physics

Volumn 32, Issue 12 S, 1993, Pages 6059-6064

  Tanaka, Toshihiko ^a   Morigami, Mitsuaki ^a   Atoda, Nobufumi ^a  

^a SORTEC Corporation   (Japan)

Author keywords

Development; Lithography; Resist; Resist pattern collapse; Resist process; Rinse; Surface tension; X ray lithography

Indexed keywords

ANGLE MEASUREMENT; CHARACTERIZATION; CONTOUR MEASUREMENT; DEFORMATION; DRYING; FAILURE (MECHANICAL); PEELING; SCANNING ELECTRON MICROSCOPY; SURFACE TENSION; SURFACES; SYNCHROTRON RADIATION;

ATOMIC FORCE MICROSCOPE; RESIST PATTERN COLLAPSE; RESIST PROCESS; RINSE LIQUID;

X RAY LITHOGRAPHY;

EID: 0027857033     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.32.6059     Document Type: Article

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