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Volumn 2, Issue 4, 1993, Pages 151-159

An Ion Milling Pattern Transfer Technique for Fabrication of Three-Dimensional Micromechanical Structures

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; ARRAYS; ETCHING; MASKS; MEDICAL APPLICATIONS; MICROMACHINING; MICROSTRUCTURE; MILLING (MACHINING); SUBSTRATES; THREE DIMENSIONAL;

EID: 0027845301     PISSN: 10577157     EISSN: 19410158     Source Type: Journal    
DOI: 10.1109/84.273091     Document Type: Article
Times cited : (33)

References (13)
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  • 5
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    • Laser-chemical three-dimensional writing of multimaterial structures for microelectromechan-ics
    • Nara, Japan
    • T. M. Bloomstein and D. J. Ehrlich, “Laser-chemical three-dimensional writing of multimaterial structures for microelectromechan-ics,” in Proc. IEEE Workshop Micro Electro Mech. Syst., MEMS-91, Nara, Japan, pp. 202-203, 1991.
    • (1991) Proc. IEEE Workshop Micro Electro Mech. Syst., MEMS-91 , pp. 202-203
    • Bloomstein, T.M.1    Ehrlich, D.J.2
  • 7
    • 0025902453 scopus 로고
    • Mating and piercing micro-mechanical structures for surface bonding applications
    • MEMS-91, Nara, Japan
    • H. Han, L. E. Weiss, and M. L. Reed, “Mating and piercing micro-mechanical structures for surface bonding applications,” in Proc. IEEE Workshop Micro Electro Mech. Syst., MEMS-91, Nara, Japan, pp. 253-258, 1991.
    • (1991) Proc. IEEE Workshop Micro Electro Mech. Syst , pp. 253-258
    • Han, H.1    Weiss, L.E.2    Reed, M.L.3
  • 8
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    • Compensating corner undercutting in anisotropic etching of (100) silicon
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    • (1989) Sensors Actuators , vol.18 , pp. 207-215
    • Wu, X.1    Ko, W.H.2
  • 9
    • 0018030427 scopus 로고
    • Anisotropic etching of silicon
    • K. E. Bean, “Anisotropic etching of silicon,” IEEE Trans. Electron Devices, vol. ED-25, no. 10, pp. 1185-1193, 1978.
    • (1978) IEEE Trans. Electron Devices , vol.ED-25 , Issue.10 , pp. 1185-1193
    • Bean, K.E.1
  • 10
    • 0014583919 scopus 로고
    • Anisotropic etching of silicon
    • D. B. Lee, “Anisotropic etching of silicon,” J. Applied Physics, vol. 40, no. 1, pp. 4569-4574, 1969.
    • (1969) J. Applied Physics , vol.40 , Issue.1 , pp. 4569-4574
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  • 11
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    • Compensation structures for convex corner micromachining in silicon
    • B. Puers and W. Sansen, “Compensation structures for convex corner micromachining in silicon,” Sensors Actuators, vol. 21, pp. 1036–1041, 1990.
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    • Puers, B.1    Sansen, W.2
  • 12
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    • Methods for the fabrication of convex corners in anisotropic etching of (100) silicon in aqueous KOH
    • L. Offereins, K. Kuhl, and H. Sandmaier, “Methods for the fabrication of convex corners in anisotropic etching of (100) silicon in aqueous KOH,” Sensors Actuators, vol. 25, pp. 9–13, 1991.
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    • Offereins, L.1    Kuhl, K.2    Sandmaier, H.3
  • 13
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    • Three-dimensional structuring of silicon for sensor applications
    • H. Seidel and L. Csepregi, “Three-dimensional structuring of silicon for sensor applications,” Sensors Actuators, vol. 4, pp. 455–463, 1983.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.