Bump heat sink technology a novel assembly technology suitable for power HBTs

Technical Digest - GaAs IC Symposium (Gallium Arsenide Integrated Circuit)

Volumn , Issue , 1993, Pages 337-340

  Sato, H ^a   Miyauchi, M ^a   Sakuno, K ^a   Akagi, M ^a   Hasegawa, M ^a   Twynam, J K ^a   Yamamura, K ^a   Tomita, T ^a  

^a SHARP CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BIPOLAR TRANSISTORS; CONSUMER ELECTRONICS; HEAT SINKS; HETEROJUNCTIONS; MONOLITHIC INTEGRATED CIRCUITS; POWER AMPLIFIERS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTOR DEVICE STRUCTURES; SEMICONDUCTOR JUNCTIONS;

ASSEMBLY TECHNOLOGY; BUMP HEAT SINK TECHNOLOGY; GOLD BUMP; MICROWAVE MONOLITHIC INTEGRATED CIRCUITS; POWER HETEROJUNCTION BIPOLAR TRANSISTORS; POWER TRANSISTORS; TRANSISTOR JUNCTION;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0027844419     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)