Effect of chip and pad geometry on solder joint formation in SMT

Journal of Electronic Packaging, Transactions of the ASME

Volumn 115, Issue 4, 1993, Pages 433-439

  Heinrich, S M ^a   Liedtke, P E ^a   Nigro, N J ^a   Elkouh, A F ^a   Lee, P S ^b  

^a MARQUETTE UNIVERSITY   (United States)

^b Allen Bradley—A Rockwell International Company ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; NUMERICAL ANALYSIS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; STRESS ANALYSIS; SURFACE MOUNT TECHNOLOGY;

CONTACT ANGLES; FILLET GEOMETRY; SURFACE MOUNT REFLOW PROCESS; ZERO GRAVITY MODEL;

SOLDERED JOINTS;

EID: 0027816311     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2909353     Document Type: Article

References (19)

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