Rigorous Analysis of Mixed Transmission Line Interconnects Using the Frequency-Domain TLM Method

IEEE Transactions on Microwave Theory and Techniques

Volumn 41, Issue 12, 1993, Pages 2248-2255

  Jin, Hang ^a   Vahldieck, Ruediger ^a,b   Huang, Jifu ^a   Russer, Peter ^b  

^a UNIVERSITY OF VICTORIA   (Canada)

^b LEIBNIZ INSTITUT FÜR HÖCHSTFREQUENZTECHNIK   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COUPLED CIRCUITS; ELECTRIC LINES; ELECTRIC WIRE; FREQUENCY DOMAIN ANALYSIS; MATHEMATICAL MODELS; MICROSTRIP DEVICES; MONOLITHIC INTEGRATED CIRCUITS; NUMERICAL ANALYSIS; SEMICONDUCTING GALLIUM ARSENIDE; SUBSTRATES; TRANSMISSION LINE THEORY; WAVEGUIDES;

BONDING WIRE TRANSITION; BONDING WIRE TRANSITIONS; COPLANAR WAVEGUIDES; FREQUENCY DOMAIN TRANSMISSION LINE MATRIX; INDIRECT COUPLING EFFECTS; MICROSTRIP SUBSTRATE CARRIER; TRANSMISSION LINE INTERCONNECTS;

ELECTRIC WIRING;

EID: 0027813660     PISSN: 00189480     EISSN: 15579670     Source Type: Journal    
DOI: 10.1109/22.260714     Document Type: Article

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