Moisture absorption behavior of printed circuit laminate materials

American Society of Mechanical Engineers, EEP

Volumn 4-1, Issue , 1993, Pages 435-442

  Liu, P C ^a   Wang, D W ^a   Livingston, E D ^a   Chen, W T ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; MOISTURE; PLASTIC LAMINATES;

DIFFUSION COEFFICIENT; MOISTURE ABSORPTION; PRINTED CIRCUIT LAMINATES;

PRINTED CIRCUIT BOARDS;

EID: 0027754944     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)