Investigation of High-Speed Pulse Transmission in MCM-D

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 16, Issue 7, 1993, Pages 735-742

  Gong, Shao Fang ^a   Strandberg, Jan ^a   Thiede, Heike ^a   Hentzell, Hans ^a   Hesselbom, Hjalmar ^b   Karner, Weine ^b  

^a ACREO AB   (Sweden)

^b ERICSSON RADIO SYSTEMS AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; ELECTRIC CONDUCTORS; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; THIN FILMS;

FAST COMPARATORS; HIGH SPEED PULSE TRANSMISSION; MULTICHIP MODULES; RESISTOR TERMINATION;

CMOS INTEGRATED CIRCUITS;

EID: 0027699931     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.257858     Document Type: Article

References (15)

1. D. J. Pedder, “Multichip module technology: the transition from research to manufacture,” Hybrid Circuits, no. 29, pp. 12–14, 1992.
2. J. J. H. Reche, “Fabrication of high density multichip modules,” IEEE Trans. Comp., Hybrids, Manuf. Technol., vol. 13, pp. 565–569, 1990.
3. M. W. Hartnett, P. D. Franzon, M. B. Steer, and E. J. Vardaman, “Worldwide status and trends in multichip module packaging,” TechSearch International Inc., Austin, TX, 1990.
4. “Multichip module (MCM) market and applications,” Lucid Information Services, 1991.
5. T. Sons, Y. Wen, and A. Agarwal, “Electrical considerations for multichip module design,” in ISHM’91 Proc., 1991, pp. 287–291.
6. J. C. Liao, O. A. Palusinski, and J. L. Prince, “Computation of transients in lossy VLSI packaging Interconnections,” IEEE Trans. Comp., Hybrids, Manuf. Technol., vol. 13, pp. 833–838, 1990.
7. E. J. Vardaman and H. N. Lee, “A cost/performance analysis of multichip module interconnects,” in Proc. ISHM’91, 1991, pp. 27–32.
8. D. Burdeaux, P. Townsend, and J. Carr, “Benzocyclobutene (BCB) dielectrics for the fabrication of high density, thin film multichip modules,” J. Electron. Mat., vol. 19, pp. 1357–1366, 1990.
9. P. A. Kohl, “Metal insulator structures for multichip modules,” in ELECTRO 91 Conf. Proc., New York, 1991, pp. 244–247.
10. H. Hesselbom, W. Karner, J. Strandberg, H. Thiede, and S. F. Gong, “High frequency transmission properties of Al-BCB and Cu-BCB Si multi-chip modules,” presented at ISHM'92, Stockholm, 1992.
11. C. Svensson, and J. Yuan, “High speed CMOS chip to chip communication circuits,” Proc. of 1991 IEEE Int. Symp. on Circuits and Systems 1991, pp, 2228–2231.
12. LINESIM, Version 1.42, HyperLynx Inc., Redmond, WA, USA.
13. GREEN-FIELD, Quantic Laboratories Inc.
14. H. B. Bakoglu, Circuits, Interconnections, and Packaging for VLSI Reading, MA: Addison-Wesley, 1990, p. 226.
15. L.-T. Hwang and I. Turlik, “A review of the skin effect as applied to thin film interconnections,” IEEE Trans. Comp., Hybrids, Manuf. Technol., vol. 15, pp. 43–55, 1992.