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Volumn 8, Issue 10, 1993, Pages 2458-2464

Role of Ag additions in the microstructural development strain tolerance, and critical current density of Ag-sheathed BSCCO superconducting tapes

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; BISMUTH COMPOUNDS; COPPER OXIDES; FITS AND TOLERANCES; GRAIN GROWTH; HEAT TREATMENT; SILVER; STRAIN; STRENGTH OF MATERIALS; SUPERCONDUCTING FILMS; TEXTURES;

EID: 0027683604     PISSN: 08842914     EISSN: 20445326     Source Type: Journal    
DOI: 10.1557/JMR.1993.2458     Document Type: Article
Times cited : (47)

References (19)
  • 15
    • 84974152794 scopus 로고
    • High-Tc Superconducting Compounds III, Annual Meeting of The Metallurgical Society, New Orleans (February
    • C. T. Wu, K. C. Goretta, D. Shi, M. T. Lanagan, and R. B. Poeppel, Proc. Symp. High-Tc Superconducting Compounds III, Annual Meeting of The Metallurgical Society, New Orleans (February 1991).
    • (1991) Proc. Symp.
    • Wu, C.T.1    Goretta, K.C.2    Shi, D.3    Lanagan, M.T.4    Poeppel, R.B.5
  • 17
    • 84974182485 scopus 로고
    • in edited by P. F. Bongers, C. Schlenker, and B. Stritzker (Mater. Res. Soc. Conf. Proc. E-6, Pittsburgh, PA,
    • J. Joo, J. P. Singh, and R. B. Poeppel, in High TcSuperconductors, edited by P. F. Bongers, C. Schlenker, and B. Stritzker (Mater. Res. Soc. Conf. Proc. E-6, Pittsburgh, PA, 1989).
    • (1989) High TcSuperconductors
    • Joo, J.1    Singh, J.P.2    Poeppel, R.B.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.