An integral heat sink for cooling microelectronic components

Journal of Electronic Packaging, Transactions of the ASME

Volumn 115, Issue 3, 1993, Pages 284-291

  Bhavnani, S H ^a   Tsai, C P ^a   Jaeger, R C ^a   Eison, D L ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; HEAT DISSIPATION; HEAT SINKS; MICROELECTRONICS; SUPERCOMPUTERS;

INTEGRAL HEAT SINKS; LIQUID IMMERSION COOLING; MINIATURIZATION;

ELECTRONICS PACKAGING;

EID: 0027662720     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2909330     Document Type: Article

References (14)

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