Analysis of Electromigration-Induced Failures in Multilayered Interconnects

IEEE Transactions on Electron Devices

Volumn 40, Issue 9, 1993, Pages 1614-1620

  Fukuda, Yasuhiro ^a   Kageyama, Makiko ^a   Tatara, Yasuyuki ^a  

^a OKI ELECTRIC INDUSTRY CO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE MEASUREMENT; ELECTRONICS PACKAGING; SEMICONDUCTING ALUMINUM COMPOUNDS; TITANIUM COMPOUNDS;

CONTACT RESISTANCE; CURRENT BYPASS EFFECT; ELECTROMIGRATION-INDUCED FAILURES; HETEROINTERFACE EVALUATION; LAYERED METAL LINE LIFETIME; MULTILAYERED INTERCONNECTS;

VLSI CIRCUITS;

EID: 0027656906     PISSN: 00189383     EISSN: 15579646     Source Type: Journal    
DOI: 10.1109/16.231566     Document Type: Article

References (13)

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