Residual stress measurement in silicon substrates after thermal oxidation

JSME International Journal, Series A: Mechanics and Material Engineering

Volumn 36, Issue 3, 1993, Pages 302-308

  Miura, Hideo ^a   Ohta, Hiroyuki ^a   Sakata, Hiroshi ^a   Okamoto, Noriaki ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

NONDESTRUCTIVE EXAMINATION; RAMAN SPECTROSCOPY; SILICON; STRESS ANALYSIS; SUBSTRATES; THERMOOXIDATION;

NONDESTRUCTIVE INSPECTION; OXIDE FILM; THERMAL OXIDATION;

RESIDUAL STRESSES;

EID: 0027625747     PISSN: 09148809     EISSN: None     Source Type: Journal    
DOI: 10.1299/jsmea1993.36.3_302     Document Type: Article

References (17)