High Quality Plasma-Enhanced Chemical Vapor Deposited Silicon Nitride Films

Journal of the Electrochemical Society

Volumn 140, Issue 7, 1993, Pages 2071-2075

  Cotler, Tina J ^a   Chapple Sokol, Jonathan ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; PLASMA APPLICATIONS; SILICON NITRIDE; STRESSES; THERMAL EFFECTS;

FOURIER TRANSFORM INFRARED SPECTROSCOPY; LOW PRESSURE CHEMICAL VAPOR DEPOSITED; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITED; RUTHERFORD BACKSCATTERING;

SEMICONDUCTING FILMS;

EID: 0027624376     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/1.2220766     Document Type: Article

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