Comparison of techniques for measuring both compressive and tensile stress in thin films

Sensors and Actuators: A. Physical

Volumn 37-38, Issue C, 1993, Pages 756-765

  van Drieenhuizen B P ^a   Goosen, J F L ^a   French, P J ^a   Wolffenbuttel, R F ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSION TESTING; MATHEMATICAL MODELS; MICROMACHINING; STRAIN MEASUREMENT; STRESS ANALYSIS; TENSILE TESTING; THIN FILMS;

BUCKLING TECHNIQUE; ON CHIP THIN FILM STRAIN MEASUREMENTS; ROTATION TECHNIQUE; THIN POLYSILICON FILMS;

SENSORS;

EID: 0027614677     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/0924-4247(93)80128-4     Document Type: Article

References (10)

1. Fine grained polysilicon and its applications to planar pressure transducers
2. Microfabricated structures for the in situ measurement of residual stress, Young modulus and ultimate strain of thin films
3. Effect of deposition conditions on intrinsic stress in a Si:H films
4. A simple technique for the determination of mechanical strain in thin films with applications to polysilicon
5. Fine-grained polysilicon films with built-in tensile strain
6. Squeeze-film damping in solid-state accelerometers, Tech. Dig.